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Abhijit Kar
Abhijit Kar
JB Centre of Excellence, Jagadis Bose National Science Talent Search (Dept. of Higher Education
Verified email at jbnsts.org - Homepage
Title
Cited by
Cited by
Year
Characterization of interface of Al2O3–304 stainless steel braze joint
A Kar, S Mandal, K Venkateswarlu, AK Ray
Materials characterization 58 (6), 555-562, 2007
562007
Effect of interfacial thickness and residual stress on the mechanical property of the alumina–stainless steel braze joint interface
A Kar, M Ghosh, AK Ray, AK Ray
Materials Science and Engineering: A 498 (1-2), 283-288, 2008
472008
Structural characterisation of reaction zone for friction stir welded aluminium–stainless steel joint
M Ghosh, A Kar, K Kumar, SV Kailas
Materials Technology 27 (2), 169-172, 2012
462012
Characterization of Al2O3–304 stainless steel braze joint interface
A Kar, AK Ray
Materials Letters 61 (14-15), 2982-2985, 2007
382007
Effect of Ag addition on the corrosion properties of Sn‐based solder alloys
QV Bui, ND Nam, BI Noh, A Kar, JG Kim, SB Jung
Materials and corrosion 61 (1), 30-33, 2010
372010
Mechanical property and characterization of a NiCoCrAlY type metallic bond coat used in turbine blade
AK Ray, N Roy, A Kar, AK Ray, SC Bose, G Das, JK Sahu, DK Das, ...
Materials Science and Engineering: A 505 (1-2), 96-104, 2009
372009
Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy
A Kar, M Ghosh, AK Ray, RN Ghosh
Materials Science and Engineering: A 459 (1-2), 69-74, 2007
332007
Synthesis of Nano-Spherical Nickel by Templating Hibiscus Flower Petals
Abhijit Kar, Ajoy Kumar Ray
American Journal of Nano Research and Applications (NANO) 2 (No. 2,), 17-20., 2014
26*2014
Role of Ti diffusion on the formation of phases in the Al2O3–Al2O3 brazed interface
A Kar, S Mandal, RN Ghosh, TK Ghosh, AK Ray
Journal of materials science 42, 5556-5561, 2007
262007
Corrosion protection of ENIG surface finishing using electrochemical methods
QV Bui, ND Nam, DH Choi, JB Lee, CY Lee, A Kar, JG Kim, SB Jung
Materials Research Bulletin 45 (3), 305-308, 2010
242010
Aging characteristics of Sn-Ag eutectic solder alloy with the addition of Cu, In, and Mn
M Ghosh, A Kar, SK Das, AK Ray
Metallurgical and Materials Transactions A 40, 2369-2376, 2009
212009
Graphite-to-304SS braze joining by active metal-brazing technique: improvement of mechanical properties
AK Ray, A Kar, SA Kori, LC Pathak, AN Sonnad
Journal of materials engineering and performance 22, 258-266, 2013
172013
Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish
QV Bui, ND Nam, JW Yoon, DH Choi, A Kar, JG Kim, SB Jung
Journal of electronic materials 40, 1937-1942, 2011
162011
Characterization of the ceramic–metal brazed interface using ultrasonic technique
A Kar, SP Sagar, AK Ray
Materials Letters 61 (19-20), 4169-4172, 2007
142007
Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface
A Kar, M Ghosh, RN Ghosh, BS Majumdar, AK Ray
Materials Letters 62 (1), 151-154, 2008
132008
A comparative study on the influence of SAC305 lead‐free solder sandwiched by Sn on the micromechanical and electrical properties of the joints
M Char, AK Chakraborty, AS Bhattacharyya, A Kar
Advanced Engineering Materials 24 (1), 2100679, 2022
102022
Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: a comparative study
M Ghosh, MK Gunjan, SK Das, A Kar, RN Ghosh, AK Ray
Materials Science and Technology 26 (5), 610-614, 2010
82010
Evaluation of hardness of the interfacial reaction products at the alumina–stainless steel brazed interface by modeling of nanoindentation results
A Kar, S Chaudhuri, PK Sen, AK Ray
Scripta materialia 57 (9), 881-884, 2007
62007
Effect of Ti diffusivity on the formation of phases in the interface of alumina-alumina brazed with 97 (Ag40Cu03Ti) filler alloy in
A Kar, S Mandal, S Rathod, AK Ray
Brazing and Soldering 2006: Proceedings of the 3rd International Brazing and …, 2006
62006
Interfacial microstructure, shear strength and electrical conductivity of Sn–3˙ 5Ag–0˙ 5In/Cu lead free soldered joints
A Kar, M Ghosh, BS Majumdar, RN Ghosh, AK Ray
Materials Technology 22 (3), 161-165, 2007
52007
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