Usage of Porous Al2O3 Layers for RH Sensing V Timár-Horváth, L Juhász, A Vass-Várnai, G Perlaky Proceedings of the Symposium on Design, Test, Integration and Packaging of …, 2007 | 30* | 2007 |
A detailed IC package numerical model calibration methodology R Bornoff, A Vass-Varnai 29th IEEE Semiconductor Thermal Measurement and Management Symposium, 65-70, 2013 | 29 | 2013 |
Characterization method for thermal interface materials imitating an in-situ environment A Vass-Várnai, Z Sárkány, M Rencz Microelectronics Journal 43 (9), 661-668, 2012 | 29 | 2012 |
Thermal Simulations and Measurements–a Combined Approach for Package Characterization A Vass-Varnai, R Bornoff, S Ress, Y Luo, A Poppe, G Farkas, M Rencz ICEP, Jpn 76 (4), 886, 2000 | 24 | 2000 |
Measurement based compact thermal model creation-accurate approach to neglect inaccurate TIM conductivity data A Vass-Varnai, R Bornoff, Z Sarkany, S Ress, M Rencz 2011 IEEE 13th Electronics Packaging Technology Conference, 67-72, 2011 | 22 | 2011 |
Issues in junction-to-case thermal characterization of power packages with large surface area A Vass-Varnai, S Gao, Z Sarkany, J Kim, S Choi, G Farkas, A Poppe, ... 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 22 | 2010 |
Package characterization: simulations or measurements? A Poppe, A Vass-Varnai, G Farkas, M Rencz 2008 10th Electronics Packaging Technology Conference, 155-160, 2008 | 15 | 2008 |
Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies Z Sarkany, A Vass-Varnai, S Laky, M Rencz 2014 semiconductor thermal measurement and management symposium (SEMI-THERM …, 2014 | 14 | 2014 |
Failure prediction of IGBT modules based on power cycling tests Z Sarkany, A Vass-Varnai, G Hantos, M Rencz 19th International Workshop on Thermal Investigations of ICs and Systems …, 2013 | 14 | 2013 |
Suggestions for extending the scope of the transient dual interface method A Poppe, A Vass-Varnai, Z Sarkany, M Rencz, G Hantos, G Farkas 2021 27th International Workshop on Thermal Investigations of ICs and …, 2021 | 13 | 2021 |
Comparison of different power cycling strategies for accelerated lifetime testing of power devices Z Sarkany, A Vass-Varnai, M Rencz Proceedings of the 5th Electronics System-integration Technology Conference …, 2014 | 13 | 2014 |
Investigation of die-attach degradation using power cycling tests Z Sarkany, A Vass-Varnai, M Rencz 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 780-784, 2013 | 13 | 2013 |
Accurate thermal characterization of power semiconductor packages by thermal simulation and measurements A Vass-Varnai, R Bornoff, S Ress, Z Sarkany, S Hodossy, M Rencz 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP …, 2011 | 13 | 2011 |
Analysis of concurrent failure mechanisms in IGBT structures during active power cycling tests Z Sarkany, A Vass-Varnai, M Rencz 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 650-654, 2014 | 12 | 2014 |
Lifetime estimation of power electronics modules considering the target application A Szel, Z Sarkany, M Bein, R Bornoff, A Vass-Varnai, M Rencz 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2015 | 11 | 2015 |
Effect of power cycling parameters on predicted IGBT lifetime Z Sarkany, A Vass-Varnai, M Rencz 2015 IEEE Aerospace Conference, 1-9, 2015 | 11 | 2015 |
Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs A Vass-Varnai, J Parry, G Toth, S Ress, G Farkas, A Poppe, M Rencz 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 594-597, 2012 | 11 | 2012 |
An alternative method to accurately determine the thermal resistance of SiC MOSFET structures with discrete diodes A Vass-Varnai, YJ Cho, G Farkas, M Rencz 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018 | 10 | 2018 |
Detailed analysis of IC packages using thermal transient testing and CFD modelling for communication device applications F Yake, W Gang, X Chen, WV Hon, X Fu, VV Andras 2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016 | 9 | 2016 |
Method for in-situ reliability testing of TIM samples A Vass-Varnai, Z Sarkany, M Rencz 2009 15th International Workshop on Thermal Investigations of ICs and …, 2009 | 8 | 2009 |