| Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC: H thin films SW King, J Bielefeld, G Xu, WA Lanford, Y Matsuda, RH Dauskardt, N Kim, ... Journal of non-crystalline solids 379, 67-79, 2013 | 85 | 2013 |
| Fundamental limits of material toughening in molecularly confined polymers SG Isaacson, K Lionti, W Volksen, TP Magbitang, Y Matsuda, ... Nature materials 15 (3), 294-298, 2016 | 65 | 2016 |
| Fracture properties of hydrogenated amorphous silicon carbide thin films Y Matsuda, SW King, J Bielefeld, J Xu, RH Dauskardt Acta materialia 60 (2), 682-691, 2012 | 48 | 2012 |
| Moisture-insensitive polycarbosilane films with superior mechanical properties Y Matsuda, JS Rathore, LV Interrante, RH Dauskardt, G Dubois ACS Applied Materials & Interfaces 4 (5), 2659-2663, 2012 | 35 | 2012 |
| Toughening Thin‐Film Structures with Ceramic‐Like Amorphous Silicon Carbide Films Y Matsuda, I Ryu, SW King, J Bielefeld, RH Dauskardt small 10 (2), 253-257, 2014 | 25 | 2014 |
| Tailored amorphous silicon carbide barrier dielectrics by nitrogen and oxygen doping Y Matsuda, SW King, RH Dauskardt Thin Solid Films 531, 552-558, 2013 | 22 | 2013 |
| Tunable plasticity in amorphous silicon carbide films Y Matsuda, N Kim, SW King, J Bielefeld, JF Stebbins, RH Dauskardt ACS applied materials & interfaces 5 (16), 7950-7955, 2013 | 21 | 2013 |
| Progress in bulk 4H SiC crystal growth for 150 mm wafer production I Manning, Y Matsuda, G Chung, E Sanchez, M Dudley, T Ailihumaer, ... Materials Science Forum 1004, 37-43, 2020 | 12 | 2020 |
| Using Unentangled Oligomers To Toughen Materials SG Isaacson, Y Matsuda, K Lionti, T Frot, W Volksen, RH Dauskardt, ... ACS applied materials & interfaces 10 (33), 27549-27554, 2018 | 10 | 2018 |
| Moisture-assisted cracking and atomistic crack path meandering in oxidized hydrogenated amorphous silicon carbide films Y Matsuda, SW King, M Oliver, RH Dauskardt Journal of Applied Physics 113 (8), 2013 | 10 | 2013 |
| Nano-hardness testing with ultrasonic excitation Y Matsuda, Y Yoon, R Brunner, A Daugela, OL Warren, FE Talke Wear 259 (7-12), 1497-1501, 2005 | 10 | 2005 |
| Curable resin composition J Kao, W Zhou, Y Matsuda, YQ Rao, M Mulzer, J Zhang US Patent App. 15/602,196, 2017 | 7 | 2017 |
| Glasslike Polymer Nanocomposite Coating via High Loading of Mixed-Size Nanoparticles Y Matsuda, J Yang, T Fitzgibbons, YQ Rao ACS Applied Polymer Materials 4 (1), 672-681, 2021 | 4 | 2021 |
| High-Temperature Dynamic Mechanical Properties Characterization of Polymer Coatings via Nanoindentation Y Matsuda, A Samadi-Dooki, Y Cen, G Vasquez, L Bu Journal of Engineering Materials and Technology 144 (2), 021011, 2022 | 3 | 2022 |
| Uv-curing acrylic resin compositions for thermoformable hard coat applications L Bu, Y Matsuda, M Mulzer US Patent App. 15/843,317, 2019 | 3 | 2019 |
| Mechanical properties of hydrogenated amorphous silicon carbide thin films Y Matsuda, SW King, J Bielefeld, RH Dauskardt 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 2 | 2010 |
| Uv-curing acrylic resin compositions for thermoformable hard coat applications L Bu, Y Matsuda, M Mulzer, CEN Yinjie US Patent App. 16/206,384, 2020 | 1 | 2020 |
| Effects of Particle Size on the Fracture Force of a Single Proppant Particle versus a Hydraulic Fracturing Proppant Pack K Aou, Y Matsuda, D Reuschle Hydraulic Fracturing Journal. Issue July, 2016 | 1 | 2016 |
| Cutting tool K Yamada, H Moroguchi, Y Matsuda, S Kukino US Patent 11,826,834, 2023 | | 2023 |
| Using an Interlayer to Toughen Flexible Colorless Polyimide-Based Cover Windows Y Matsuda, Y Cen, L Bu, J Zhang, K Kourtakis, T Huang, Y Song, ... Coatings 13 (9), 1597, 2023 | | 2023 |
