Effect of strain rate and filler size on mechanical behavior of a Cu filled elastomer based composite S Oberoi, D Sonawane, P Kumar Composites Science and Technology 127, 185-192, 2016 | 15 | 2016 |
New insights into dewetting of Cu thin films deposited on Si D Sonawane, A Choudhury, P Kumar Langmuir 36 (20), 5534-5545, 2020 | 12 | 2020 |
New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing D Sonawane, P Kumar Engineering Fracture Mechanics 238, 107281, 2020 | 10 | 2020 |
Effect of aspect ratio of test specimens on quasistatic compression loading and stress-relaxation of PDMS and a Cu-filled-PDMS composite D Sonawane, S Oberoi, P Kumar Polymer Testing 55, 173-183, 2016 | 7 | 2016 |
Role of grain boundary sliding in structural integrity of Cu-filled through Si via during isothermal annealing D Sonawane, P Kumar Journal of Electronic Materials 50 (3), 767-778, 2021 | 5 | 2021 |
Stability of Cu-islands formed on Si substrate via ‘dewetting’under subsequent thermal cycling D Sonawane, P Kumar Nanotechnology 32 (19), 195703, 2021 | 5 | 2021 |
Mechanical reliability of photovoltaic cells under cyclic thermal loading D Sonawane, PC Ramamurthy, P Kumar Journal of Electronic Materials 49, 59-71, 2020 | 3 | 2020 |
Design, Manufacturing and Performance Analysis of Spiral Coil Pump NR Patil, SR Gaikwad, RA Navale, DS Sonawane Applied Mechanics and Materials 446, 549-552, 2014 | 3 | 2014 |
Effect of accelerated thermal cyclic loading on structural reliability of cu-filled TSV D Sonawane, P Kumar 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 1-5, 2019 | 1 | 2019 |
Dynamic Testing of Iron-Aluminium Alloy Microparticles Fabricated using a Solid-State Dewetting D Sonawane, L Bhaskar, LB Bellón, D Chatain, M Palm, JP Best, G Dehm, ... FEMS EUROMAT 2023, 2023 | | 2023 |
Dynamic Cryo-Mechanical Properties of Dewetted Nickel Microparticles LB Bellón, L Bhaskar, D Sonawane, R Aymerich Armengol, T Brink, ... TMS 2023 152nd Annual Meeting and Exhibition, 2023 | | 2023 |
Mechanical Reliability of Metal-Si Systems at different Length scales under Thermal Cyclic Loading D Sonawane | | 2021 |
Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi SP Singh, D Sonawane, P Kumar Metallurgical and Materials Transactions A 50, 2690-2701, 2019 | | 2019 |