Dipali Sonawane
Dipali Sonawane
Max-Planck-Institut für Eisenforschung,Düsseldorf
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Effect of strain rate and filler size on mechanical behavior of a Cu filled elastomer based composite
S Oberoi, D Sonawane, P Kumar
Composites Science and Technology 127, 185-192, 2016
New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing
D Sonawane, P Kumar
Engineering Fracture Mechanics 238, 107281, 2020
New insights into dewetting of Cu thin films deposited on Si
D Sonawane, A Choudhury, P Kumar
Langmuir 36 (20), 5534-5545, 2020
Effect of aspect ratio of test specimens on quasistatic compression loading and stress-relaxation of PDMS and a Cu-filled-PDMS composite
D Sonawane, S Oberoi, P Kumar
Polymer Testing 55, 173-183, 2016
Role of grain boundary sliding in structural integrity of Cu-filled through Si via during isothermal annealing
D Sonawane, P Kumar
Journal of Electronic Materials 50, 767-778, 2021
Stability of Cu-islands formed on Si substrate via ‘dewetting’under subsequent thermal cycling
D Sonawane, P Kumar
Nanotechnology 32 (19), 195703, 2021
Mechanical reliability of photovoltaic cells under cyclic thermal loading
D Sonawane, PC Ramamurthy, P Kumar
Journal of Electronic Materials 49, 59-71, 2020
Design, Manufacturing and Performance Analysis of Spiral Coil Pump
NR Patil, SR Gaikwad, RA Navale, DS Sonawane
Applied Mechanics and Materials 446, 549-552, 2014
Effect of accelerated thermal cyclic loading on structural reliability of cu-filled TSV
D Sonawane, P Kumar
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 1-5, 2019
Dynamic Testing of Iron-Aluminium Alloy Microparticles Fabricated using a Solid-State Dewetting
D Sonawane, L Bhaskar, LB Bellón, D Chatain, M Palm, JP Best, G Dehm, ...
FEMS EUROMAT 2023, 2023
Dynamic Cryo-Mechanical Properties of Dewetted Nickel Microparticles
LB Bellón, L Bhaskar, D Sonawane, R Aymerich Armengol, T Brink, ...
TMS 2023 152nd Annual Meeting and Exhibition, 2023
Mechanical Reliability of Metal-Si Systems at different Length scales under Thermal Cyclic Loading
D Sonawane
Creep of Cu-Bi Alloys with High Bi Content Near and Above Melting Temperature of Bi
SP Singh, D Sonawane, P Kumar
Metallurgical and Materials Transactions A 50, 2690-2701, 2019
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