| Quasiparticle interaction in liquid 3He S Babu, GE Brown Annals of Physics 78 (1), 1-38, 1973 | 312 | 1973 |
| Cobalt polishing with reduced galvanic corrosion at copper/cobalt interface using hydrogen peroxide as an oxidizer in colloidal silica-based slurries BC Peethala, HP Amanapu, URK Lagudu, SV Babu Journal of The Electrochemical Society 159 (6), H582, 2012 | 99 | 2012 |
| Silica and silica-based slurry SD Hellring, CP McCann, SV Babu, Y Li, S Narayanan, RL Auger US Patent 7,279,119, 2007 | 71 | 2007 |
| Heat transfer and material removal in pulsed excimer‐laser‐induced ablation: Pulsewidth dependence GC D’couto, SV Babu Journal of applied physics 76 (5), 3052-3058, 1994 | 68 | 1994 |
| Transport phenomena in chemical mechanical polishing RS Subramanian, L Zhang, SV Babu Journal of The Electrochemical Society 146 (11), 4263, 1999 | 52 | 1999 |
| Chemical-Mechanical Polishing 2001-Advances and Future Challenges: Volume 671 SV Babu, KC Cadien, H Yano Cambridge University Press, 2001 | 42 | 2001 |
| Study of surface charge effects on oxide and nitride planarization using alumina/ceria mixed abrasive slurries S Hegde, SV Babu Electrochemical and solid-state letters 7 (12), G316, 2004 | 34 | 2004 |
| Role of polycation adsorption in poly-Si, SiO2 and Si3N4 removal during chemical mechanical polishing: Effect of polishing pad surface chemistry NK Penta, JB Matovu, PRD Veera, S Krishnan, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 388 (1-3 …, 2011 | 30 | 2011 |
| Silicon nitride film removal during chemical mechanical polishing using ceria-based dispersions PRV Dandu, BC Peethala, HP Amanapu, SV Babu Journal of The Electrochemical Society 158 (8), H763, 2011 | 27 | 2011 |
| Abrasive compositions for chemical mechanical polishing and methods for using same SV Babu, P Dandu, VK Devarapalli, G Criniere, C Pitois US Patent 8,822,340, 2014 | 24 | 2014 |
| Chemical-mechanical polishing slurry and method YS Her, R Srinivasan, S Babu, S Ramarajan US Patent 6,702,954, 2004 | 24 | 2004 |
| Slurry for chemical mechanical polishing silicon dioxide R Srinivasan, SV Babu, WG America, YS Her US Patent 6,627,107, 2003 | 22 | 2003 |
| Chemical mechanical planarization of germanium shallow trench isolation structures using silica-based dispersions S Peddeti, P Ong, LHA Leunissen, SV Babu Microelectronic Engineering 93, 61-66, 2012 | 21 | 2012 |
| Corrosion resistance of diamond-like carbon-coated aluminum films C Srividya, SV Babu Chemistry of materials 8 (10), 2528-2533, 1996 | 21 | 1996 |
| Slurry and method for chemical-mechanical planarization of copper S Babu, S Hegde, S Jha, U Patri, Y Hong US Patent App. 10/846,718, 2005 | 18 | 2005 |
| Silica and a silica-based slurry S Hellring, C McCann, S Babu, Y Li, S Narayanan US Patent App. 09/882,549, 2003 | 18 | 2003 |
| Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si (1 0 0) over silicon dioxide, silicon nitride or copper during chemical … PRV Dandu, NK Penta, SV Babu Colloids and Surfaces A: Physicochemical and Engineering Aspects 371 (1-3 …, 2010 | 14 | 2010 |
| Polishing slurries and methods for chemical mechanical polishing SC Jha, S Nimmala, S Hegde, Y Hong, SV Babu, UB Patri US Patent 7,186,653, 2007 | 14 | 2007 |
| Mechanism of Cu removal during CMP in H2O2-glycine based slurries M Hariharaputhiran, S Ramarajan, Y Li, SV Babu MRS Online Proceedings Library (OPL) 566, 129, 1999 | 13 | 1999 |
| Origin of high oxide to nitride polishing selectivity of ceria-based slurry in the presence of picolinic acid LY Wang, B Liu, ZT Song, WL Liu, SL Feng, H David, SV Babu Chinese Physics B 20 (3), 038102, 2011 | 9 | 2011 |
