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Youngin Goh
Youngin Goh
KAIST 전기 및 전자공학부 박사
Verified email at kaist.ac.kr
Title
Cited by
Cited by
Year
The effect of the bottom electrode on ferroelectric tunnel junctions based on CMOS-compatible HfO2
Y Goh, S Jeon
Nanotechnology 29 (33), 335201, 2018
1492018
Oxygen vacancy control as a strategy to achieve highly reliable hafnia ferroelectrics using oxide electrode
Y Goh, SH Cho, SHK Park, S Jeon
Nanoscale 12 (16), 9024-9031, 2020
1212020
The influence of top and bottom metal electrodes on ferroelectricity of hafnia
Y Lee, Y Goh, J Hwang, D Das, S Jeon
IEEE Transactions on Electron Devices 68 (2), 523-528, 2021
942021
Ultra-thin Hf0. 5Zr0. 5O2 thin-film-based ferroelectric tunnel junction via stress induced crystallization
Y Goh, J Hwang, Y Lee, M Kim, S Jeon
Applied Physics Letters 117 (24), 2020
912020
Sub-60-mV/decade negative capacitance FinFET with sub-10-nm hafnium-based ferroelectric capacitor
E Ko, H Lee, Y Goh, S Jeon, C Shin
IEEE Journal of the Electron Devices Society 5 (5), 306-309, 2017
732017
Enhanced tunneling electroresistance effects in HfZrO-based ferroelectric tunnel junctions by high-pressure nitrogen annealing
Y Goh, S Jeon
Applied Physics Letters 113 (5), 2018
632018
Effect of forming gas high-pressure annealing on metal-ferroelectric-semiconductor hafnia ferroelectric tunnel junction
J Hwang, Y Goh, S Jeon
IEEE Electron Device Letters 41 (8), 1193-1196, 2020
462020
Excellent Reliability and High-Speed Antiferroelectric HfZrO2 Tunnel Junction by a High-Pressure Annealing Process and Built-In Bias Engineering
Y Goh, J Hwang, S Jeon
ACS Applied Materials & Interfaces 12 (51), 57539-57546, 2020
422020
Crystalline phase-controlled high-quality Hafnia ferroelectric with RuO₂ electrode
Y Goh, SH Cho, SHK Park, S Jeon
IEEE Transactions on Electron Devices 67 (8), 3431-3434, 2020
382020
Selector-less ferroelectric tunnel junctions by stress engineering and an imprinting effect for high-density cross-point synapse arrays
Y Goh, J Hwang, M Kim, Y Lee, M Jung, S Jeon
ACS Applied Materials & Interfaces 13 (49), 59422-59430, 2021
372021
Effect of insertion of dielectric layer on the performance of Hafnia ferroelectric devices
J Hwang, Y Goh, S Jeon
IEEE Transactions on Electron Devices 68 (2), 841-845, 2020
332020
Flexible ferroelectric hafnia-based synaptic transistor by focused-microwave annealing
H Joh, M Jung, J Hwang, Y Goh, T Jung, S Jeon
ACS Applied Materials & Interfaces 14 (1), 1326-1333, 2021
252021
Improved Ferroelectric Switching in Sputtered HfZrOx Device Enabled by High Pressure Annealing
J Woo, Y Goh, S Im, JH Hwang, Y Kim, JH Kim, JP Im, SM Yoon, SE Moon, ...
IEEE Electron Device Letters 41 (2), 232-235, 2019
212019
High Performance and Self-rectifying Hafnia-based Ferroelectric Tunnel Junction for Neuromorphic Computing and TCAM Applications
Y Goh, J Hwang, M Kim, M Jung, S Lim, SO Jung, S and Jeon
International Electron Devices Meeting (IEDM), 2021
182021
Defects and charge-trapping mechanisms of double-active-layer In–Zn–O and Al–Sn–Zn–In–O thin-film transistors
Y Goh, T Kim, JH Yang, JH Choi, CS Hwang, SH Cho, S Jeon
ACS Applied Materials & Interfaces 9 (11), 9271-9279, 2017
182017
First-order reversal curve diagrams for characterizing ferroelectricity of Hf0. 5Zr0. 5O2 films grown at different rates
Y Goh, S Jeon
Journal of Vacuum Science & Technology B 36 (5), 2018
142018
Enabling large ferroelectricity and excellent reliability for ultra-thin hafnia-based ferroelectrics with a W bottom electrode by inserting a metal-nitride diffusion barrier
M Kim, Y Goh, J Hwang, S Jeon
Applied Physics Letters 119 (26), 2021
92021
Efficient Suppression of Defects and Charge Trapping in High Density In–Sn–Zn–O Thin Film Transistor Prepared using Microwave-Assisted Sputter
Y Goh, J Ahn, JR Lee, WW Park, SH Ko Park, S Jeon
ACS applied materials & interfaces 9 (42), 36962-36970, 2017
82017
Physics, Structures, and Applications of Fluorite‐Structured Ferroelectric Tunnel Junctions
J Hwang, Y Goh, S Jeon
Small 20 (9), 2305271, 2024
72024
Relatively Low-k Ferroelectric Nonvolatile Memory Using Fast Ramping Fast Cooling Annealing Process
J Hwang, M Kim, M Jung, T Kim, Y Goh, Y Lee, S Jeon
IEEE Transactions on Electron Devices 69 (6), 3439-3445, 2022
72022
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