| Pitting corrosion resistance of ultrafine-grained aluminum processed by severe plastic deformation IJ Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita Materials Transactions 47 (4), 1163-1169, 2006 | 51 | 2006 |
| Binder–free of NiCo–layered double hydroxides on Ni–coated textile for wearable and flexible supercapacitors YM Jeong, I Son, SH Baek Applied Surface Science 467, 963-967, 2019 | 48 | 2019 |
| Pitting corrosion resistance of anodized aluminum alloy processed by severe plastic deformation IJ Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita Materials Transactions 48 (1), 21-28, 2007 | 37 | 2007 |
| Pitting corrosion resistance of anodized aluminum-copper alloy processed by severe plastic deformation IJ Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita Materials transactions 49 (11), 2648-2655, 2008 | 36 | 2008 |
| Fabrication process and thermoelectric properties of CNT/Bi2(Se,Te)3 composites KT Kim, YS Eom, I Son Journal of Nanomaterials 16 (1), 83-83, 2015 | 32 | 2015 |
| Effect of equal-channel angular pressing on pitting corrosion of pure aluminum I Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita International Journal of Corrosion 2012, 2012 | 24 | 2012 |
| Self-propagating heat synthetic reactivity of fine aluminum particles via spontaneously coated nickel layer DW Kim, KT Kim, GH Kwon, K Song, I Son Scientific Reports 9 (1), 1033, 2019 | 21 | 2019 |
| Effect of annealing on the pitting corrosion resistance of anodized aluminum-magnesium alloy processed by severe plastic deformation IJ Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita Materials transactions 49 (11), 2656-2663, 2008 | 20 | 2008 |
| Effects of High-Pressure Torsion on the Pitting Corrosion Resistance of Aluminum–Iron Alloys H Nakano, H Yamaguchi, Y Yamada, S Oue, IJ Son, Z Horita, H Koga Materials Transactions 54 (9), 1642-1649, 2013 | 17 | 2013 |
| Fine-tuning of mechanical properties of additively manufactured AlSi10Mg alloys by controlling the microstructural heterogeneity YS Eom, JM Park, JW Choi, DJ Seong, H Joo, YC Jo, KT Kim, JH Yu, ... Journal of Alloys and Compounds 956, 170348, 2023 | 16 | 2023 |
| Enhancement of bonding strength in BiTe-based thermoelectric modules by electroless nickel, electroless palladium, and immersion gold surface modification YN Nguyen, S Kim, SH Bae, I Son Applied Surface Science 545, 149005, 2021 | 16 | 2021 |
| The influence of interfacial defect-region on the thermoelectric properties of nanodiamond-dispersed Bi2Te2. 7Se0. 3 matrix composites TS Min, KT Kim, I Son Applied Surface Science 415, 109-113, 2017 | 16 | 2017 |
| Characterization of copper–graphite composites fabricated via electrochemical deposition and spark plasma sintering M Byun, D Kim, K Sung, J Jung, YS Song, S Park, I Son Applied Sciences 9 (14), 2853, 2019 | 15 | 2019 |
| Effect of reaction product of epichlorohydrin and imidazole on the electrodeposition behavior of Zn–Ni alloy from Alkaline zincate solution SH Bae, S Oue, I Son, H Nakano isij international 61 (8), 2256-2263, 2021 | 14 | 2021 |
| Pitting corrosion resistance of anodized aluminum alloy processed by severe plastic deformation IJ Son, H Nakano, S Oue, S Kobayashi, H Fukushima, Z Horita Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals 70 (7 …, 2006 | 14 | 2006 |
| Effect of surface roughness and electroless Ni–P plating on the bonding strength of Bi–Te-based thermoelectric modules SH Bae, S Kim, SH Yi, I Son, KT Kim, H Chung Coatings 9 (3), 213, 2019 | 13 | 2019 |
| Effect of pH on the morphological evolution of NiO thin film synthesized on ZnO nanorod arrays by electrodeposition and post-annealing HB Kim, H Kim, HS Sohn, I Son, HS Lee Materials letters 101, 65-68, 2013 | 13 | 2013 |
| Diffusion bonding at the interface of Bi2Te3 thermoelectric modules YN Nguyen, I Son Materials Chemistry and Physics 292, 126813, 2022 | 12 | 2022 |
| Performance of Bi2Te3-based thermoelectric modules tailored by diffusion barriers YN Nguyen, KT Kim, SH Chung, I Son Journal of Alloys and Compounds 895, 162716, 2022 | 12 | 2022 |
| Enhanced output power of thermoelectric modules with reduced contact resistance by adopting the optimized Ni diffusion barrier layer JM Park, DY Hyeon, HS Ma, S Kim, ST Kim, YN Nguyen, I Son, S Yi, ... Journal of Alloys and Compounds 884, 161119, 2021 | 12 | 2021 |
Kyung Tae KimKorea Institute of Materials ScienceVerified email at kims.re.kr
