| Packaging and assembly challenges for 50G silicon photonics interposers B Snyder, N Mangal, G Lepage, S Balakrishnan, X Sun, N Pantano, ... Optical Fiber Communication Conference, Tu2A. 3, 2018 | 29 | 2018 |
| Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics N Mangal, J Missinne, G Roelkens, JV Campenhout, GV Steenberge, ... 2018 Optical Fiber Communications Conference and Exposition (OFC), paper Tu2A.1, 2018 | 16* | 2018 |
| Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses J Missinne, NT Benéitez, N Mangal, J Zhang, A Vasiliev, ... Silicon Photonics XIV 10923, 1092304, 2019 | 10 | 2019 |
| Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-m-Thick Silicon Photonics Interposers N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder IEEE Photonics Journal 11 (3), 1-11, 2019 | 9 | 2019 |
| Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne Optics Express 29 (5), 7601-7615, 2021 | 8 | 2021 |
| Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne IEEE Journal of Selected Topics in Quantum Electronics 26 (2), 1-7, 2019 | 8 | 2019 |
| Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects N Mangal, J Missinne, J Van Campenhout, G Van Steenberge, B Snyder Optical Interconnects XIX 10924, 37-48, 2019 | 6 | 2019 |
| Packaging silicon photonics with polymer waveguides for 3D electro-optical integration N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder 2017 IEEE Photonics Conference (IPC), 707-708, 2017 | 6 | 2017 |
| Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects N Mangal, J Missinne, J Van Campenhout, B Snyder, G Van Steenberge Journal of Lightwave Technology 38 (8), 2360-2369, 2020 | 5 | 2020 |
| Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling N Mangal, J Missinne, JV Campenhout, GV Steenberge, B Snyder Electronic Components and Technology Conference (ECTC), 2018 IEEE, 2018 | 5 | 2018 |
| Alignment-tolerant coupling interfaces for board-level integration of silicon photonics N Mangal Ghent University, 2020 | 1 | 2020 |
| SOI strip waveguide microring resonator for homogeneous biosensing S Malathi, N Mangal, SA Samad, RV Honnungar, T Srinivas Novel Optical Systems Design and Optimization XIV 8129, 96-102, 2011 | 1 | 2011 |
| SOI Based Integrated-Optic Microring Resonators for Biomedical Sensing Applications N Mangal | | 2018 |
| Laser processing for large area polymer photonic applications G Van Steenberge, E Bosman, J Missinne, K Kaur, S Naithani, ... 8th International Symposium on Flexible Organic Electronics (ISFOE15), 2015 | | 2015 |
Joris Van CampenhoutimecVerified email at imec.be
