Nivesh Mangal
Nivesh Mangal
imec-UGent, Belgium
Verified email at - Homepage
Cited by
Cited by
Packaging and assembly challenges for 50G silicon photonics interposers
B Snyder, N Mangal, G Lepage, S Balakrishnan, X Sun, N Pantano, ...
Optical Fiber Communication Conference, Tu2A. 3, 2018
Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics
N Mangal, J Missinne, G Roelkens, JV Campenhout, GV Steenberge, ...
2018 Optical Fiber Communications Conference and Exposition (OFC), paper Tu2A.1, 2018
Alignment-tolerant interfacing of a photonic integrated circuit using back side etched silicon microlenses
J Missinne, NT Benéitez, N Mangal, J Zhang, A Vasiliev, ...
Silicon Photonics XIV 10923, 1092304, 2019
Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-m-Thick Silicon Photonics Interposers
N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder
IEEE Photonics Journal 11 (3), 1-11, 2019
Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling
N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne
Optics Express 29 (5), 7601-7615, 2021
Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics
N Mangal, B Snyder, J Van Campenhout, G Van Steenberge, J Missinne
IEEE Journal of Selected Topics in Quantum Electronics 26 (2), 1-7, 2019
Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects
N Mangal, J Missinne, J Van Campenhout, G Van Steenberge, B Snyder
Optical Interconnects XIX 10924, 37-48, 2019
Packaging silicon photonics with polymer waveguides for 3D electro-optical integration
N Mangal, J Missinne, G Van Steenberge, J Van Campenhout, B Snyder
2017 IEEE Photonics Conference (IPC), 707-708, 2017
Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects
N Mangal, J Missinne, J Van Campenhout, B Snyder, G Van Steenberge
Journal of Lightwave Technology 38 (8), 2360-2369, 2020
Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling
N Mangal, J Missinne, JV Campenhout, GV Steenberge, B Snyder
Electronic Components and Technology Conference (ECTC), 2018 IEEE, 2018
Alignment-tolerant coupling interfaces for board-level integration of silicon photonics
N Mangal
Ghent University, 2020
SOI strip waveguide microring resonator for homogeneous biosensing
S Malathi, N Mangal, SA Samad, RV Honnungar, T Srinivas
Novel Optical Systems Design and Optimization XIV 8129, 96-102, 2011
SOI Based Integrated-Optic Microring Resonators for Biomedical Sensing Applications
N Mangal
Laser processing for large area polymer photonic applications
G Van Steenberge, E Bosman, J Missinne, K Kaur, S Naithani, ...
8th International Symposium on Flexible Organic Electronics (ISFOE15), 2015
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