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Ankur Jain
Ankur Jain
Professor, Mechanical and Aerospace Engineering, University of Texas at Arlington
Verified email at uta.edu - Homepage
Title
Cited by
Cited by
Year
Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3ω method
DW Oh, A Jain, JK Eaton, KE Goodson, JS Lee
International Journal of Heat and Fluid Flow 29 (5), 1456-1461, 2008
2972008
Measurement of anisotropic thermophysical properties of cylindrical Li-ion cells
SJ Drake, DA Wetz, JK Ostanek, SP Miller, JM Heinzel, A Jain
Journal of Power Sources 252, 298-304, 2014
2872014
Heat generation rate measurement in a Li-ion cell at large C-rates through temperature and heat flux measurements
SJ Drake, M Martin, DA Wetz, JK Ostanek, SP Miller, JM Heinzel, A Jain
Journal of Power Sources 285, 266-273, 2015
1952015
Analytical and numerical modeling of the thermal performance of three-dimensional integrated circuits
A Jain, RE Jones, R Chatterjee, S Pozder
IEEE Transactions on Components and Packaging Technologies 33 (1), 56-63, 2009
1882009
Experimental and theoretical analysis of a method to predict thermal runaway in Li-ion cells
K Shah, D Chalise, A Jain
Journal of Power Sources 330, 167-174, 2016
1362016
Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3ω method
A Jain, KE Goodson
Journal of Heat Transfer 130 (10), 102402, 2008
1302008
Investigation of the natural convection boundary condition in microfabricated structures
XJ Hu, A Jain, KE Goodson
International Journal of Thermal Sciences 47 (7), 820-824, 2008
1282008
Nano/Microscale pyroelectric energy harvesting: Challenges and opportunities
D Lingam, AR Parikh, J Huang, A Jain, M Minary-Jolandan
International Journal of Smart and Nano Materials 4, 1-17, 2013
1242013
Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer fused deposition modeling (FDM)
H Prajapati, D Ravoori, RL Woods, A Jain
Additive Manufacturing 21, 84-90, 2018
1042018
Experimental and numerical investigation of core cooling of Li-ion cells using heat pipes
K Shah, C McKee, D Chalise, A Jain
Energy 113, 852-860, 2016
1042016
Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits
I Savidis, SM Alam, A Jain, S Pozder, RE Jones, R Chatterjee
Microelectronics Journal 41 (1), 9-16, 2010
922010
Thermal modeling and design of 3D integrated circuits
A Jain, RE Jones, R Chatterjee, S Pozder, Z Huang
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
892008
Determination of the core temperature of a Li-ion cell during thermal runaway
M Parhizi, MB Ahmed, A Jain
Journal of Power Sources 370, 27-35, 2017
872017
Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport
V Vishwakarma, C Waghela, Z Wei, R Prasher, SC Nagpure, J Li, F Liu, ...
Journal of Power Sources 300, 123-131, 2015
842015
Measurement of Multiscale Thermal Transport Phenomena in Li-Ion Cells: A Review
K Shah, V Vishwakarma, A Jain
Journal of Electrochemical Energy Conversion and Storage 13 (3), 030801, 2016
792016
Far-Field Interrogation of Microstrip Patch Antenna for Temperature Sensing Without Electronics
J Yao, FM Tchafa, A Jain, S Tjuatja, H Huang
IEEE Sensors Journal 16 (19), 7053-7060, 2016
712016
Modeling of steady-state convective cooling of cylindrical Li-ion cells
K Shah, SJ Drake, DA Wetz, JK Ostanek, SP Miller, JM Heinzel, A Jain
Journal of Power Sources 258, 374-381, 2014
702014
An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC)
L Choobineh, A Jain
International Journal of Thermal Sciences 87, 103-109, 2015
672015
Temperature distribution in multi-layer skin tissue in presence of a tumor
D Sarkar, A Haji-Sheikh, A Jain
International Journal of Heat and Mass Transfer 91, 602-610, 2015
642015
Analytical solution for steady-state and transient temperature fields in vertically stacked 3-D integrated circuits
L Choobineh, A Jain
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012
642012
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