The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon S Lee, S Park, DI Cho Microelectromechanical Systems, Journal of 8 (4), 409-416, 1999 | 176 | 1999 |
Surface/bulk micromachined single-crystalline-silicon micro-gyroscope S Lee, S Park, J Kim, S Lee, DI Cho Microelectromechanical Systems, Journal of 9 (4), 557-567, 2000 | 153 | 2000 |
Isolation in micromachined single crystal silicon using deep trench insulation D Cho, S Lee, S Park, S Lee US Patent 6,472,290, 2002 | 46 | 2002 |
A novel 3D process for single-crystal silicon micro-probe structures S Park, B Kim, J Kim, S Paik, BD Choi, I Jung, K Chun Journal of micromechanics and microengineering 12 (5), 650, 2002 | 39 | 2002 |
The effects of post-deposition processes on polysilicon Young's modulus S Lee, C Cho, J Kim, S Park, S Yi, J Kim, DD Cho Journal of micromechanics and microengineering 8 (4), 330, 1998 | 35 | 1998 |
Surface/bulk micromachining (SBM) process and deep trench oxide isolation method for MEMS S Lee, S Park, D Cho, Y Oh Electron Devices Meeting, 1999. IEDM'99. Technical Digest. International …, 1999 | 34 | 1999 |
An x-axis single-crystalline silicon microgyroscope fabricated by the extended SBM process J Kim, S Park, D Kwak, H Ko, DD Cho Microelectromechanical Systems, Journal of 14 (3), 444-455, 2005 | 32 | 2005 |
Robust SOI process without footing and its application to ultra high-performance microgyroscopes J Kim, S Park, D Kwak, H Ko, W Carr, J Buss, DD Cho Sensors and Actuators A: Physical 114 (2), 236-243, 2004 | 31 | 2004 |
A novel MEMS silicon probe card BH Kim, S Park, B Lee, JH Lee, BG Min, SD Choi, D Cho, K Chun Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International …, 2002 | 31 | 2002 |
A new micromachining technique with (111) silicon S Lee, S Park, D Cho Japanese journal of applied physics 38, 2699, 1999 | 30 | 1999 |
Mesa-supported, single-crystal microstructures fabricated by the surface/bulk micromachining process S Park, S Lee, S Cho Japanese journal of applied physics 38, 4244, 1999 | 27 | 1999 |
Triple layer isolation for silicon microstructure and structures formed using the same D Cho, S Lee, S Park US Patent 6,569,702, 2003 | 24 | 2003 |
A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology J Kim, S Park, DI Cho Sensors and Actuators A: Physical 97, 653-658, 2002 | 24 | 2002 |
A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology J Kim, S Park, DD Cho Transducers’ 01 Eurosensors XV, 756-759, 2001 | 20 | 2001 |
Selective silicon-on-insulator (SOI) implant: a new micromachining method without footing and residual stress S Park, D Kwak, H Ko, T Song, D Cho Journal of Micromechanics and Microengineering 15 (9), 1607, 2005 | 18 | 2005 |
Probe structure for testing semiconductor devices and method for fabricating the same D Cho, S Park US Patent 6,724,204, 2004 | 18 | 2004 |
The first sub-deg/HR bias stability, silicon-microfabricated gyroscope B Choi, S Park, H Ko, SJ Paik, Y Park, G Lim, A Lee, SC Lee, W Carr, ... Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical …, 2005 | 17 | 2005 |
Wafer-level hermetic packaged microaccelerometer with fully differential BiCMOS interface circuit H Ko, S Park, B Choi, A Lee Sensors and Actuators A: Physical 137 (1), 25-33, 2007 | 16 | 2007 |
A fine pitch MEMS probe unit for flat panel display as manufacturing MEMS application BH Kim, SJ Park, K Chun, DI Cho, WK Park, TU Jun, S Yun Sensors and Actuators A: Physical 115 (1), 46-52, 2004 | 16 | 2004 |
Why is (111) silicon a better mechanical material for MEMS: Torsion case D Kwak, J Kim, S Park, H Ko, D Cho ASME, 2003 | 15 | 2003 |