| Highly compressible, anisotropic aerogel with aligned cellulose nanofibers J Song, C Chen, Z Yang, Y Kuang, T Li, Y Li, H Huang, I Kierzewski, B Liu, ... ACS nano 12 (1), 140-147, 2018 | 399 | 2018 |
| Advanced packaging and thermal management of high-power DC-DC converters SU Yuruker, RK Mandel, P McCluskey, MM Ohadi, S Chakraborty, Y Park, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 13 | 2019 |
| Highly compressible, anisotropic aerogel with aligned cellulose nanofibers. ACS Nano 12: 140–147 J Song, C Chen, Z Yang, Y Kuang, T Li, Y Li, H Huang, I Kierzewski, B Liu, ... | 12 | 2018 |
| An experimental and computational study on efficiency of white LED packages with a thermocaloric approach SU Yuruker, E Tamdogan, M Arik IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 12 | 2017 |
| Electro-thermal co-design of a cooling system-integrated high-frequency transformer Y Park, S Yuruker, S Chakraborty, A Khaligh, R Mandel, P McCluskey, ... 2020 IEEE Transportation Electrification Conference & Expo (ITEC), 26-31, 2020 | 9 | 2020 |
| A metamodeling approach for optimization of manifold microchannel systems for high heat flux cooling applications SU Yuruker, RK Mandel, A Shooshtari, MM Ohadi 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 8 | 2019 |
| Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics SU Yuruker, DG Bae, RK Mandel, B Yang, P McCluskey, A Bar-Cohen, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 8 | 2017 |
| System-level Pareto frontiers for on-chip thermoelectric coolers SU Yuruker, MC Fish, Z Yang, N Baldasaro, P Barletta, A Barcohen, ... Frontiers in Energy 12, 109-120, 2018 | 7 | 2018 |
| A vertically enhanced manifold microchannel system for thermal management of power electronics SU Yuruker, RK Mandel, P McCluskey, M Ohadi IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 5 | 2021 |
| Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS) SU Yuruker, RK Mandel, P McCluskey, MM Ohadi Journal of Heat Transfer 143 (10), 101501, 2021 | 4 | 2021 |
| Thermo-mechanical design considerations in 3D-integrated SiC power device package FP McCluskey, H Yun, CE Buxbaum, S Yuruker, R Mandel, M Ohadi, ... 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 4 | 2020 |
| System-level thermal modeling and its significance in electronics packaging SU Yuruker, RK Mandel, P McCluskey, M Ohadi 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| Development of Combined Cooler with Additively Manufactured Planar Magnetics H Yun, S Yuruker, R Mandel, C Buxbaum, FP McCluskey, M Hinojosa 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2082-2088, 2021 | 2 | 2021 |
| Thermal and optical performance of eco-friendly silk fibroin proteins as a cavity encapsulation over LED systems SU Yuruker, M Arik, E Tamdogan, R Melikov, S Nizamoglu, DA Press, ... International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 2 | 2015 |
| Packaging and Thermal Decoupling of an Optical Array using a Thermoelectric Cooler SU Yuruker, RK Mandel, DG Bae, V Gektin, MM Ohadi 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 1 | 2018 |
| ADVANCED PACKAGING AND THERMAL MANAGEMENT OF DC-DC CONVERTERS AND NOVEL CORRELATIONS FOR MANIFOLD MICROCHANNEL HEATSINKS SU Yuruker | | 2021 |
| Thermoelectric Cooling of High Flux Electronics SU Yuruker University of Maryland, College Park, 2017 | | 2017 |
| LAST YEAR’S BEST PAPERS (ITherm 2019) C Graphene, NSU Ray | | |
