| Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads TJS Anand, CK Yau, YS Leong, LW Keat, HM Ting Current applied physics 13 (8), 1674-1683, 2013 | 17 | 2013 |
| Oxidation study on as-bonded intermetallic of copper wire–aluminum bond pad metallization for electronic microchip TJS Anand, CK Yau, LB Huat Materials Chemistry and Physics 136 (2-3), 638-647, 2012 | 13 | 2012 |
| Copper wire reliability and bonding integrity robustness on cratering sensitive bond pad structure LC Chian, NK Chai, LC Chia, CM King, LO Seng, CK Yau 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing …, 2006 | 11 | 2006 |
| Manufacturing a package using plateable encapsulant SW Chan, CF Chiang, KY Chua, SL Goh, SK Lee, J Mahler, MC Ng, ... US Patent App. 15/448,018, 2017 | 10 | 2017 |
| Warpage of thin wafers using computer aided reflection moire method CS Ng, KY Chua, MT Ong, YC Goh, AK Asundi Advanced Characterization Techniques for Optics, Semiconductors, and …, 2007 | 7 | 2007 |
| XRD analysis of Cu-Al interconnect intermetallic compound in an annealed micro-chip KY Chua, MT Hng, CC Lee, TJS Anand Advanced Materials Research 620, 166-172, 2013 | 5 | 2013 |
| Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device KY Chua, SW Chan, CF Chiang, S Martens, M Steiert, KH Yeo, HS Chua, ... US Patent 9,475,691, 2016 | 4 | 2016 |
| Semiconductor package with plateable encapsulant and a method for manufacturing the same SW Chan, CF Chiang, KY Chua, SL Goh, SK Lee, J Mahler, MC Ng, ... US Patent 10,396,007, 2019 | 3 | 2019 |
| Bond strength evaluation of heat treated Cu-Al wire bonding S Shariza, TJS Anand, ARM Warikh, LC Chia, CK Yau, LB Huat Journal of Mechanical Engineering and Sciences 12 (4), 4275-4284, 2018 | 3 | 2018 |
| Effect of impact force towards Cu wire bonding reliability LC Chia, CK Yau, TS Chee 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-5, 2015 | 3 | 2015 |
| Micro-structural studies of thermosonic Cu-Al bonding interface TJS Anand, C Kok Yau, A Jalar Advanced Materials Research 925, 154-158, 2014 | 3 | 2014 |
| Statistical analysis on the mechanical and micro-structural characteristics of thermosonic CuAl interconnection CK Yau, TJS Anand, S Shariza, YF Khong, LC Chia, LB Huat, R Singh, ... Microelectronics Reliability 109, 113664, 2020 | 2 | 2020 |
| Micro-electrical mechanical system sensor package and method of manufacture thereof CF Chiang, KY Chua US Patent 10,631,100, 2020 | 2 | 2020 |
| System and method for over under sensor packaging SW Chan, CF Chiang, KY Chua, SK Lee, CY Ng US Patent App. 15/653,234, 2019 | 2 | 2019 |
| Manufacturing a package using plateable encapsulant SW Chan, CF Chiang, KY Chua, SL Goh, SK Lee, J Mahler, MC Ng, ... US Patent 11,081,417, 2021 | 1 | 2021 |
| Device having substrate with conductive pillars CF Chiang, KY Chua, SK Lee, CY Ng, V Solomko US Patent 10,163,812, 2018 | 1 | 2018 |
| Modelling of wire bonding Cu-Al intermetallic formation growth towards interfacial stress LC Chia, CK Yau, TJS Anand, S Shariza, MRB Jamli 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-5, 2017 | 1 | 2017 |
| Voltage regulator module with inductor-cooled power stage G Deboy, KY Chua, A Kessler, KK Leong, CY Ng, L Peluso US Patent App. 17/742,442, 2023 | | 2023 |
| Method for Fabricating an Electrical Device Package Comprising Plateable Encapsulating Layers KY Chua, PAA Calo, CH Lee US Patent App. 17/741,597, 2022 | | 2022 |
| Method for connecting an electrical device to a bottom unit by using a solderless joint CF Chiang, PAA Calo, CL Cha, KY Chua, CH Lee, SK Lee, TC Long, ... US Patent App. 17/677,055, 2022 | | 2022 |
T. Joseph Sahaya AnandEx. Professor, Universiti Teknikal Malaysia Melaka (UTeM)Verified email at graduate.hku.hk
