| Enabling technology in thin wafer dicing J Van Borkulo, R Evertsen, R Hendriks ECS Transactions 18 (1), 837, 2009 | 19 | 2009 |
| Arrangement and method for forming one or more separated scores in a surface of a substrate J Van Borkulo, PH Chall US Patent 7,947,920, 2011 | 17 | 2011 |
| Laser vs. blade dicing for direct bonded heterogeneous integration (DBHi) Si bridge A Jain, K Sikka, JM Gomez, D Parekh, M Bergendahl, J van Borkulo, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1125-1130, 2021 | 9 | 2021 |
| Multi beam full cut dicing of thin Si IC wafers J Van Borkulo, P Verburg, R Van Der Stam 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1817-1822, 2017 | 8 | 2017 |
| Paradigm shift in compound semiconductor production since the introduction of laser dicing R Hendriks, J van Borkulo, M Mueller Proceedings of Compound Semiconductor Manufacturing Technology Conference, 18-21, 2009 | 6 | 2009 |
| Comparison between Single & Multi Beam Laser Grooving of Low-K layers J van Borkulo, R Hendriks, P Dijkstra International Symposium on Microelectronics 2012 (1), 000433-000439, 2012 | 5 | 2012 |
| A more than moore enabling wafer dicing technology J van Borkulo, R Evertsen, R van der Stam 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 423-427, 2019 | 4 | 2019 |
| Laser-Based Full Cut Dicing Evaluations for Thin Si Wafers J van Borkulo, R van der Stam 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1951-1955, 2018 | 4 | 2018 |
| Multi Beam Low-κ Grooving Evaluation of various removal principals R van der Stam, J van Borkulo, P Dijkstra International Symposium on Microelectronics 2013 (1), 000564-000568, 2013 | 2 | 2013 |
| First Multi Beam Full Cut Laser Dicing of Thin Low K Wafers JV Borkulo, R Hendriks ECS Transactions 27 (1), 891, 2010 | 2 | 2010 |
| A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications A Jain, K Sikka, S Li, JM Gomez, M Bergendahl, S Skordas, J Van Borkulo, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 24-29, 2022 | 1 | 2022 |
| Wafer Thinning and Dicing Technology for 3D Nand Flash Q Ma, J Lin, H Liu, J van Borkulo 2019 China Semiconductor Technology International Conference (CSTIC), 1-4, 2019 | 1 | 2019 |
| Multi beam low-k grooving evaluation of various removal principals R van der Stam, J van Borkulo, P Dijkstra 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-5, 2013 | 1 | 2013 |
| Multi Beam Grooving and Full Cut Laser Dicing of IC Wafers JV Borkulo, R Hendriks ECS Transactions 34 (1), 873, 2011 | 1 | 2011 |
| A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning S Raghavan, A Jain, PR Chowdhury, K Sakuma, R Doll, K Biesheuvel, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 139-146, 2023 | | 2023 |
| Laser-Based Full Cut Dicing Evaluations for Thin Si wafers P Dijkstra, J van Borkulo, R van der Stam 2020 China Semiconductor Technology International Conference (CSTIC), 1-5, 2020 | | 2020 |
| Laser Multi Beam Full Cut Dicing of Wafer Level Chip-Scale Packages J van Borkulo, N Okamoto, T Yamada, T Menjo, M Nakamura 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 337-342, 2017 | | 2017 |
| Laser multi beam full cut dicing of wafer level chip-scale packages (FAN IN) J van Borkulo, EMM Tan, R Boulanger 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 752-757, 2016 | | 2016 |
| Multi Beam Grooving and Full Cut Laser Dicing of IC Wafers J Van Borkulo, R Hendriks, P Dijkstra ECS Transactions 44 (1), 969, 2012 | | 2012 |
Aakrati JainIBMVerified email at ibm.com
