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Pavani Vamsi Krishna Nittala
Pavani Vamsi Krishna Nittala
Micron Technology, University of Chicago and Argonne National Laboratory
Verified email at micron.com - Homepage
Title
Cited by
Cited by
Year
Design and fabrication of piezoresistive based encapsulated poly-Si cantilevers for bio/chemical sensing
NPV Krishna, TRS Murthy, KJ Reddy, K Sangeeth, GM Hegde
Physics Procedia 19, 319-324, 2011
82011
Enabling transfer of ultrathin layers of GaN for demonstration of a heterogenous stack on copper heat spreader
PVK Nittala, N Remesh, S Niranjan, S Tasneem, S Raghavan, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019
62019
Scaling a fluorescent detection system by polymer-assisted 3-D integration of heterogeneous dies
PVK Nittala, P Sen
Journal of Microelectromechanical Systems 27 (5), 896-909, 2018
62018
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies
PVK Nittala, K Haridas, S Nigam, S Tasneem, P Sen
Journal of Vacuum Science & Technology B 39 (5), 2021
42021
3D die level packaging for hybrid systems
NPV Krishna, P Sen
2016 IEEE International Interconnect Technology Conference/Advanced …, 2016
42016
Fabrication and characterisation of bulk micromachined ZnO energy transducer with interdigitated electrodes
P Chhabra, A Sharma, NPV Krishna
Microsystem Technologies 22, 1055-1066, 2016
42016
Integration of silicon chip microstructures for in-line microbial cell lysis in soft microfluidics
PVK Nittala, A Hohreiter, ER Linhard, R Dohn, S Mishra, A Konda, ...
Lab on a Chip 23 (9), 2327-2340, 2023
32023
Effect of substrate transfer on performance of vertically stacked ultrathin MOS devices
PVK Nittala, K Sahoo, N Bhat, KN Bhat, P Sen
IEEE Transactions on Electron Devices 66 (3), 1153-1159, 2019
32019
Gallium nitride transistor on glass using epoxy mediated substrate transfer technology
NPV Krishna, N Ramesh, N Mohan, R Muralidharan, S Raghavan, ...
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-3, 2017
22017
Effect of thermal cycling on electrical properties in 3D die level packaging
NPV Krishna, P Sen
2016 3rd International Conference on Emerging Electronics (ICEE), 1-3, 2016
22016
Heterogeneous Integration by the 3D Stacking of Thin Silicon Die
PVK Nittala, K Haridas, P Sen
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 608-613, 2022
12022
Die level 3D heterogeneous integration of a microfluidic system
NPV Krishna, P Sen
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-3, 2017
12017
Controlled Spalling of 4H Silicon Carbide Films for Power Electronics and Quantum Information Science
C Horn, A Wellisz, C Wicker, C Zeledon, PVK Nittala, FJ Heremans, ...
Bulletin of the American Physical Society, 2024
2024
Nanofabrication and Demonstration of a Direct‐Write Microevaporator
X Doi, PVK Nittala, B Fu, KZ Latt, S Mishra, L Silverman, L Woodard, ...
Small Science 4 (2), 2300121, 2024
2024
Nanofabrication and Demonstration of a Direct-Write Microevaporator
PVK Nittala, B Fu, KZ Latt, S Mishra, L Silverman, L Woodard, R Divan, ...
Small Science, 2023
2023
Microfluidic and mems cell lysis system and method
B Anindita, A Konda, PVK Nittala, S Guha
US Patent App. 18/252,529, 2023
2023
3D Packaging for Integration of Heterogeneous Systems
PVK Nittala
2020
MEMS Resonator Filters
RM Patrikar
Institution of Engineering and Technology, 2020
2020
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