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Dr.Chandra Rao
Dr.Chandra Rao
Agency for Science , Technology and Research
Verified email at lamresearch.com
Title
Cited by
Cited by
Year
Wear behaviour of AE42+ 20% saffil Mg-MMC
AK Mondal, BSSC Rao, S Kumar
Tribology International 40 (2), 290-296, 2007
702007
Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
BSSC Rao, J Weng, L Shen, TK Lee, KY Zeng
Microelectronic engineering 87 (11), 2416-2422, 2010
672010
Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites
VL Niranjani, BSSC Rao, V Singh, SV Kamat
Materials Science and Engineering: A 529, 257-264, 2011
422011
The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy
VL Niranjani, BSSC Rao, R Sarkar, SV Kamat
Journal of alloys and compounds 542, 136-141, 2012
412012
The effect of high energy mechanochemical processing on the microstructure, piezoelectric, ferroelectric and mechanical properties of PLZT ceramics
AR James, BSSC Rao, M Pathak, SV Kamat, J Subrahmanyam
Nanotechnology 19 (19), 195201, 2008
312008
The effect of mixed mode I/III loading on the fracture toughness of Timetal 834 titanium alloy
BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 476 (1-2), 162-168, 2008
262008
The effect of volume fraction of primary α phase on fracture toughness behaviour of Timetal 834 titanium alloy under mode I and mixed mode I/III loading
BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 520 (1-2), 29-35, 2009
222009
Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
BSSC Rao, KM Kumar, V Kripesh, KY Zeng
Materials Science and Engineering: A 528 (12), 4166-4172, 2011
192011
Water-based gelcasting of lead zirconate titanate and evaluation of mechanical properties of the gelcast samples
S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (9), 817-820, 2007
152007
Effect of temperature on fracture toughness of Timetal 834 titanium alloy under mode I and mixed mode I/III loading
BSS Chandra Rao, M Srinivas, SV Kamat
Metallurgical and Materials Transactions A 39, 1340-1349, 2008
132008
Evaluation of mechanical properties of gelcast lead zirconate titanate disks sintered at different temperatures
S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (11), 1024-1027, 2007
102007
Creep behaviour of SAC387 lead free solder alloy reinforced with single walled carbon nanotubes
VL Niranjani, V Singh, BSS Chandra Rao, SV Kamat
Transactions of the Indian Institute of Metals 68, 311-317, 2015
92015
Structural, thermal, electromechanical and mechanical property studies on (Pb0. 93La0. 07)(Zr0. 60Ti0. 40) O3 ceramics synthesized by a high energy mechanochemical milling process
AR James, BSSC Rao, SV Kamat, J Subrahmanyam, K Srinivas, ...
Smart materials and structures 17 (3), 035020, 2008
92008
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
BSSC Rao, KM Kumar, KY Zeng, AAO Tay, V Kripesh
2009 11th Electronics Packaging Technology Conference, 272-277, 2009
72009
Effect of gold addition on the microstructure and mechanical properties of Sn–3.8 Ag–0.7 Cu lead-free solder alloy
VL Niranjani, P Venkateswarlu, V Singh, BSS Chandra Rao, SV Kamat
Transactions of the Indian Institute of Metals 71, 1497-1505, 2018
62018
Under-Bump Metallization Contact Resistance ( ) Characterization at 10- Polymer Passivation Opening
P Lianto, KJ Chui, B Bhushan, HMC Chua, L Tang, BSSC Rao, X Wang, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017
52017
One-step TSV process development for 4-layer wafer stacked DRAM
M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 673-679, 2021
42021
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints
BSSC Rao, DM Fernandez, V Kripesh, KY Zeng
2010 12th Electronics Packaging Technology Conference, 423-428, 2010
42010
Wafer Stacked Wide I/O DRAM with One-step TSV Technology
M Kawano, XY Wang, Q Ren, WL Loh, BSSC Rao, KJ Chui, T Kawagoe, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 143-148, 2022
32022
Determination of tensile properties of lead-free solder joints using nanoindentation
BSSC Rao, KY Zeng, V Kripesh
2010 12th Electronics Packaging Technology Conference, 309-314, 2010
32010
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