Dr.Chandra Rao
Dr.Chandra Rao
Verified email at lamresearch.com
TitleCited byYear
Wear behaviour of AE42+ 20% saffil Mg-MMC
AK Mondal, BSSC Rao, S Kumar
Tribology International 40 (2), 290-296, 2007
572007
Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
BSSC Rao, J Weng, L Shen, TK Lee, KY Zeng
Microelectronic engineering 87 (11), 2416-2422, 2010
502010
Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites
VL Niranjani, BSSC Rao, V Singh, SV Kamat
Materials Science and Engineering: A 529, 257-264, 2011
332011
The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy
VL Niranjani, BSSC Rao, R Sarkar, SV Kamat
Journal of Alloys and Compounds 542, 136-141, 2012
252012
The effect of mixed mode I/III loading on the fracture toughness of Timetal 834 titanium alloy
BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 476 (1-2), 162-168, 2008
202008
The effect of high energy mechanochemical processing on the microstructure, piezoelectric, ferroelectric and mechanical properties of PLZT ceramics
AR James, BSSC Rao, M Pathak, SV Kamat, J Subrahmanyam
Nanotechnology 19 (19), 195201, 2008
192008
Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
BSSC Rao, KM Kumar, V Kripesh, KY Zeng
Materials Science and Engineering: A 528 (12), 4166-4172, 2011
172011
The effect of volume fraction of primary α phase on fracture toughness behaviour of Timetal 834 titanium alloy under mode I and mixed mode I/III loading
BSSC Rao, M Srinivas, SV Kamat
Materials Science and Engineering: A 520 (1-2), 29-35, 2009
152009
Water-based gelcasting of lead zirconate titanate and evaluation of mechanical properties of the gelcast samples
S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (9), 817-820, 2007
122007
Effect of temperature on fracture toughness of Timetal 834 titanium alloy under mode I and mixed mode I/III loading
BSSC Rao, M Srinivas, SV Kamat
Metallurgical and Materials Transactions A 39 (6), 1340, 2008
112008
Structural, thermal, electromechanical and mechanical property studies on (Pb0. 93La0. 07)(Zr0. 60Ti0. 40) O3 ceramics synthesized by a high energy mechanochemical milling process
AR James, BSSC Rao, SV Kamat, J Subrahmanyam, K Srinivas, ...
Smart Materials and Structures 17 (3), 035020, 2008
92008
Evaluation of mechanical properties of gelcast lead zirconate titanate disks sintered at different temperatures
S Roy, BSSC Rao, J Subrahmanyam
Scripta Materialia 57 (11), 1024-1027, 2007
92007
Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
BSSC Rao, KM Kumar, KY Zeng, AAO Tay, V Kripesh
2009 11th Electronics Packaging Technology Conference, 272-277, 2009
62009
Creep behaviour of SAC387 lead free solder alloy reinforced with single walled carbon nanotubes
VL Niranjani, V Singh, BSSC Rao, SV Kamat
Transactions of the Indian Institute of Metals 68 (2), 311-317, 2015
42015
Determination of tensile properties of lead-free solder joints using nanoindentation
BSSC Rao, KY Zeng, V Kripesh
2010 12th Electronics Packaging Technology Conference, 309-314, 2010
32010
Effect of Gold Addition on the Microstructure and Mechanical Properties of Sn–3.8 Ag–0.7 Cu Lead-Free Solder Alloy
VL Niranjani, P Venkateswarlu, V Singh, BSSC Rao, SV Kamat
Transactions of the Indian Institute of Metals 71 (6), 1497-1505, 2018
12018
Effect of solder volume on diffusion kinetics and mechanical properties of microbump solder joints
BSSC Rao, DM Fernandez, V Kripesh, KY Zeng
2010 12th Electronics Packaging Technology Conference, 423-428, 2010
12010
Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications
BSSC Rao, V Kripesh, KY Zeng
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 100-108, 2011
2011
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