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Tapano Kumar Hotta
Tapano Kumar Hotta
School of Mechanical Engineering (SMEC), VIT Vellore
Verified email at vit.ac.in - Homepage
Title
Cited by
Cited by
Year
Statistical analysis of different machining characteristics of EN-24 alloy steel during dry hard turning with multi-layer coated cermet inserts
A Das, SK Patel, TK Hotta, BB Biswal
Measurement 134, 123 - 141, 2019
372019
Optimal distribution of discrete heat sources under mixed convection—a heuristic approach
T Kumar Hotta, C Balaji, SP Venkateshan
Journal of Heat Transfer 136 (10), 2014
302014
Optimal distribution of discrete heat sources under natural convection using ann–ga based technique
TK Hotta, SP Venkateshan
Heat Transfer Engineering 36 (2), 200-211, 2015
252015
Experiment driven ANN-GA based technique for optimal distribution of discrete heat sources under mixed convection
TK Hotta, C Balaji, SP Venkateshan
Experimental Heat Transfer 28 (3), 298-315, 2015
242015
Numerical investigation on optimal arrangement of IC chips mounted on a SMPS board cooled under mixed convection
VK Mathew, TK Hotta
Thermal Science and Engineering Progress 7, 221-229, 2018
232018
Effect of surface radiation heat transfer on the optimal distribution of discrete heat sources under natural convection
TK Hotta, P Muvvala, SP Venkateshan
Heat and Mass Transfer 49 (2), 207-217, 2013
232013
A review on cooling of discrete heated modules using liquid jet impingement
NG Patil, TK Hotta
Frontiers in Heat and Mass Transfer (FHMT) 11 (16), 2018
192018
Natural and mixed convection heat transfer cooling of discrete heat sources placed near the bottom on a PCB
TK Hotta, SP Venkateshan
Proc. World Acad. Sci. Eng. Technol 6 (8), 1446-1453, 2012
192012
Role of PCM based mini-channels for the cooling of multiple protruding IC chips on the SMPS board - A numerical study
VK Mathew, TK Hotta
Journal of Energy Storage 26, 2019
162019
An Optimal Approach for Improving the Machinability of Nimonic C 263 Superalloy During Cryogenic Assisted Turning
PS Jadhav, CP Mohanty, TK Hotta, M Gupta
Journal of Manufacturing Process 58, 693-705, 2020
142020
Experiment and numerical investigation on optimal distribution of discrete ICs for different orientation of substrate board
VK Mathew, TK Hotta
International Journal of Ambient Energy 43 (1), 1607-1614, 2022
102022
Role of working fluids on the cooling of discrete heated modules - A numerical approach
NG Patil, TK Hotta
SADHANA - Academy Proceedings in Engineering Sciences 43 (11), 187, 2018
102018
Numerical investigation of natural and mixed convection heat transfer on optimal distribution of discrete heat sources mounted on a substrate
MV Karvinkoppa, TK Hotta
IOP Conf. Series: Materials Science and Engineering 263, 062066, 2017
102017
Experimental Investigation of Substrate Board Orientation Effect on the Optimal Distribution of IC Chips under Forced Convection
VK Mathew, TK Hotta
Experimental Heat Transfer 34 (6), 564-585, 2021
92021
Performance Enhancement of High Heat Generating IC Chips using Paraffin Wax Based Mini-channels – A Combined Experimental and Numerical Approach  
VK Mathew, TK Hotta
International Journal of Thermal Sciences 164, 106865, 2021
72021
A combined numerical simulation and optimization model for the cooling of IC chips under forced convection
NG Patil, TK Hotta
International Journal of Modern Physics - C (IJMPC) 31 (6), 2050081, 2020
62020
Experimental Investigation of Mixed Convection and Surface Radiation Heat Transfer from Protruding Discrete Heat Sources Mounted on a Vertical Channel
TK Hotta, P Sri Harsha, SP Venkateshan
Heat Transfer Research 49 (10), 965-977, 2018
42018
Transient Analysis of Phase Change Material for the Cooling of Discrete Heat Sources Under Mixed Convection
VK Mathew, TK Hotta
Journal of Energy and Environmental Sustainability 8, 1-6, 2019
3*2019
Transient Analysis of Phase Change Material for Cooling of Discrete Heat Sources under Mixed Convection
MV Karvinkoppa, TK Hotta
Proceedings of the 7th International and 45th National Conference on Fluid …, 2018
32018
Heat Transfer Characteristics of High Heat Generating Integrated Circuit Chips Cooled Using Liquid Cold Plate—A Combined Numerical and Experimental Study
NG Patil, TK Hotta
ASME Journal of Thermal Science and Engineering Applications 13 (1), 2021
22021
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