| Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering M Yang, H Ji, S Wang, YH Ko, CW Lee, J Wu, M Li Journal of Alloys and Compounds 679, 18-25, 2016 | 100 | 2016 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5 Ag solder on a Cu pad YK Jee, YH Ko, J Yu Journal of materials research 22 (7), 1879-1887, 2007 | 79 | 2007 |
| Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties M Yang, SW Kim, S Zhang, DY Park, CW Lee, YH Ko, H Yang, Y Xiao, ... Journal of Materials Chemistry C 6 (27), 7207-7218, 2018 | 57 | 2018 |
| Controlling interfacial reactions and intermetallic compound growth at the interface of a lead-free solder joint with layer-by-layer transferred graphene YH Ko, JD Lee, T Yoon, CW Lee, TS Kim ACS applied materials & interfaces 8 (8), 5679-5686, 2016 | 52 | 2016 |
| Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications BS Lee, YH Ko, JH Bang, CW Lee, S Yoo, JK Kim, JW Yoon Microelectronics Reliability 71, 119-125, 2017 | 48 | 2017 |
| Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate M Yang, YH Ko, J Bang, TS Kim, CW Lee, M Li Materials Characterization 124, 250-259, 2017 | 47 | 2017 |
| Power module packaging technology with extended reliability for electric vehicle applications JW Yoon, JH Bang, YH Ko, SH Yoo, JK Kim, CW Lee Journal of the Microelectronics and Packaging Society 21 (4), 1-13, 2014 | 44 | 2014 |
| Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints YK Jee, J Yu, YH Ko Journal of Materials Research 22 (10), 2776-2784, 2007 | 44 | 2007 |
| Evaluation on reliability of high temperature lead-free solder for automotive electronics YH Ko, SH Yoo, CW Lee Journal of the Microelectronics and Packaging Society 17 (4), 35-40, 2010 | 36 | 2010 |
| Laser-engineered oxygen vacancies for improving the NO 2 sensing performance of SnO 2 nanowires YJ Kwon, HW Kim, WC Ko, H Choi, YH Ko, YK Jeong Journal of Materials Chemistry A 7 (48), 27205-27211, 2019 | 34 | 2019 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates M Yang, YH Ko, J Bang, TS Kim, CW Lee, S Zhang, M Li Journal of Alloys and Compounds 701, 533-541, 2017 | 34 | 2017 |
| Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate J Bang, DY Yu, YH Ko, JH Son, H Nishikawa, CW Lee Microelectronics Reliability 99, 62-73, 2019 | 28 | 2019 |
| Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint JH Bang, DY Yu, YH Ko, JW Yoon, CW Lee Journal of Welding and Joining 34 (1), 26-34, 2016 | 28* | 2016 |
| Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint J Bang, DY Yu, YH Ko, H Nishikawa, CW Lee 2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-8, 2018 | 27 | 2018 |
| The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5 Ag solder YK Lee, YH Ko, JK Kim, CW Lee, S Yoo Electronic Materials Letters 9, 31-39, 2013 | 25 | 2013 |
| Microstructure evolution, interfacial reaction and mechanical properties of lead-free solder bump prepared by induction heating method M Yang, S Yang, H Ji, YH Ko, CW Lee, J Wu, M Li Journal of Materials Processing Technology 236, 84-92, 2016 | 20 | 2016 |
| Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module J Son, M Kim, DY Yu, YH Ko, JW Yoon, CW Lee, YB Park, J Bang Journal of Welding and Joining 35 (5), 38-47, 2017 | 18 | 2017 |
| Oxygen Evolution Reaction of Co-Mn-O Electrocatalyst Prepared by Solution Combustion Synthesis KR Park, JE Jeon, G Ali, YH Ko, J Lee, HS Han, S Mhin Catalysts 9 (6), 564, 2019 | 16 | 2019 |
| Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics K Choi, DY Yu, S Ahn, KH Kim, JH Bang, YH Ko Microelectronics Reliability 86, 66-71, 2018 | 16 | 2018 |
| Synthesis of rod-type Co2. 4Mn0. 6O4 via oxalate precipitation for water splitting catalysts KR Park, JE Jeon, K Kim, N Oh, YH Ko, J Lee, SH Lee, JH Ryu, HS Han, ... Applied Surface Science 510, 145390, 2020 | 15 | 2020 |
Taek-Soo KimProfessor of Mechanical Engineering, KAISTVerified email at kaist.ac.kr
